STUDY ON ELECTRONIC PACKAGE MINIATURE BALL GRID ARRAY SOLDER JOINTS STRESS AND STRAIN UNDER THREE POINT BENDING
LIANG Ying
HUANG ChunYue
YIN Rui
HUANG Wei
LI TianMing
ZHAO HongWang
Keywords：Microelectronic packageBall grid array solder jointThree point bending loadFinite element analysisStress and strain
Publication Date：2016-01-01
Online Publishing Date：2026-09-12(First online date of this platform, not the publication date of the document)